ELECTRIC PRESS FIT MACHINE

Category:Soldering and joining technology for PCBs (soldering, gluing, dispensing, coating equipment, etc)
Application field:Industrial electronics、Communication systems、Consumer electronics、Automotive industry、New energy、Aviation & Space technology

MCP-10T, known for its strong compatibility, can adapt to the vast majority of crimping products and is the best solution for small batches and multiple models. The Press Fit process is a solderless electronic assembly technology that inserts the PIN of the connecting device into the PCBA. As a highly reliable technology, it is widely used in industries such as communication and automotive electronics, military industry, and photovoltaic new energy.

China (including Hong Kong, Macau and Taiwan) | 5J09

Messe München GmbH

Messegelände

81823 München

Tel: +49 89 949-20720
Fax: +49 89 949-20729
info@messe-muenchen.de

MMI (Shanghai) Co., Ltd.

11th floor, GC Tower, 1088 Yuanshen Rd

Shanghai

Tel: +86 21 2020 5500
Fax: +86 21 2020 5688
info@mm-sh.com