Wafer Level and Panel Level Fan Out D/A

Wafer Format:Ring(wafer)

wafer Size:6"/8"/12"dia

Substrate Format:Ring(wafer)/Medium Panel(玻璃，不锈钢，双面铜基板、PCB载板）

Substrate Size:12"DIA./340x340mm²~Option)

Input Handling:Cassette&Foup

Output Handling:Cassette&Foup

XY Placement:±12μm(Global) / ±10μm(local)

Die Rotation:±5°

Sprint UPH:Pick up UPH: 20K± 10%（for die size 1*1mm global alignment）

Handler:Windows 10

Vision:Windows 10

Voltage:220 VAC, single phase 1L1N1G, max. 15A

(depending on customer facility)

Frequency:50/60 Hz

Compressed Air:6 Bar

Vacuum Supply:-65 kpa at 200.0 Liter/min

Power:3KW

Dimension (mm) L x W x H:2500 X 1300 X 1850

Weight:Approx. 1800 KG