iAB series Automatic Wafer Bonding Equipment

Category:Soldering and joining technology for PCBs (soldering, gluing, dispensing, coating equipment, etc)
Application field:Industrial electronics、Communication systems、Consumer electronics、Computers & Peripherals、Automotive industry、Medical technology、New energy、Aviation & Space technology

iAB series products are automatic wafer bonding equipment independently developed by iSTAR for automatic wafer to wafer automic bonding applications.

Shenzhen iStar Technology (Group) Co., Ltd.

China (including Hong Kong, Macau and Taiwan) | 5K50

Messe München GmbH

Messegelände

81823 München

Tel: +49 89 949-20720
Fax: +49 89 949-20729
info@messe-muenchen.de

MMI (Shanghai) Co., Ltd.

11th floor, GC Tower, 1088 Yuanshen Rd

Shanghai

Tel: +86 21 2020 5500
Fax: +86 21 2020 5688
info@mm-sh.com