iCB series Automatic Chip Bonding Equipment

iCB series products are automatic chip bonding equipment independently developed by iSTAR, which features automic high precision chip to chip, chip to wafer bonding, and is suitable for application as infrared sensor, Micro LED and chiplet etc.

Shenzhen iStar Technology (Group) Co., Ltd.

China (including Hong Kong, Macau and Taiwan) | 5K50

Exhibitor Profile

Newscenter

Messe München GmbH

Messegelände

81823 München

Tel:	+49 89 949-20720
Fax:	+49 89 949-20729

info@messe-muenchen.de

MMI (Shanghai) Co., Ltd.

11th floor, GC Tower, 1088 Yuanshen Rd

Shanghai

Tel:	+86 21 2020 5500
Fax:	+86 21 2020 5688

info@mm-sh.com

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iCB series Automatic Chip Bonding Equipment

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