CN01

MAX UPH:1K

Features:

The thimble system adopts multi-level demoulding mode to effectively protect the safety of large-size chips

Non-contact device corrector - ensures that the device will not be damaged by contact action

Intelligent technology: Precise force control, easy machine adjustment and optimal device protection

User-friendly operation interface, help more efficient debugging and model switching

Test sockets come with air or nitrogen pre-test cleaning

Cleaning function for automatic grinding and polishing

Devices can be classified by Mapping

Wafer reconstruction

Settings:

Input: Max 12 "Wafer

Output: Max 12 "Wafer

Function:max 4 Test station, static/dynamic/Hot temperature

Adaptable size:

Die Size: 0.6 x 0.3 to 20 x 20mm,larger dies can be specified by customer