CN40(Automatic Turret Wafer Level Sorting System)

Wafer to tape reel

Features:

High speed device processing: UPH up to 40,000pcs (@Die size 1x1mm)

Non-contact device corrector - ensures that the device will not be damaged by contact action

Intelligent technology: Precise force control, easy machine adjustment and optimal device protection

User-friendly operation interface, help more efficient debugging and model switching

6-side visual inspection, IR vision can achieve internal defect detection

Devices can be classified by Mapping

Tape/reel automatic feed function

The setup process for handling new devices is simple and fast

Settings:

Input: Max 12 "Wafer

Output: Tape braid

Function:Laser Marking,Test,Open short/DC/AC

Adaptable size:

Die Size:0.6x0.3 to 7x7mm